High-Density Cooling Enclosures

Self-contained rack enclosures with up to 18kW cooling capacity for high-density server deployments in space-constrained and/or uncontrolled environments.

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When spreading out the load or building additional data center space just isn't an option

With the advent of blade and other high-density servers, heat densities have climbed to challenging levels. In many instances, the amount of heat generated per rack exceeds that which can be effectively handled by traditional air-cooled solutions. The APC High-density Cooling Enclosure with patent-pending horizontal airflow design is a self-contained, closed loop system that utilizes chilled water to cool up to 18kW per rack. This innovative concept is a quickly deployable, space-saving, scalable, and energy efficient alternative to cooling high-density IT loads.

Features & Benefits
Availability
Horizontal airflow design	Ensures uniform delivery of cool air to installed IT equipment.
N+1 redundant fans	Provide higher availability to installed equipment with six fans supporting installed equipment in an N+1 configuration.
Temperature regulation	Ensures installed IT equipment always maintains acceptable inlet air temperatures.
Leak detection	Notifies user in the event of a water leak within the coiling unit.
Hot swappable fans	Allows system to remain operational if a fan replacement is required.
Hot swappable cooling coil	Allows system to remain operational if a cooling coil replacement is required.
Access independent airflow	Fans continue to provide adequate airflow even when doors are opened.
Fail-safe control system	Ensures sufficient cooling is still provided by enabling maximum fan speed in the unlikely event of a control system failure.

Agility
Ships fully assembled	Allows for fast deployment.

Protection
Isolated cooling circuit	A separate, isolated section which houses all cooling components minimizes the risk of water contacting installed IT equipment in the unlikely event of a leak.
Dew point monitoring	Prevents condensation from forming inside the enclosure by dissuading access when the external dew point is above supply air temperature.
Sealed enclosure	Prevents infiltration of dust and moisture while preventing dissipation of heat into installation environment.
Insulated double wall construction	Prevents condensation from forming on the outside of the enclosure and reduces noise emission.
Smart card door access	Provides easy and secure access to system.

Manageability
Warning indicator light	Provides highly visible, local notification of problematic events.
Remote management	Remote monitoring of key alarm conditions such as fan failure and leak detection via SNMP, telnet, and web browser is possible with optional Remote Monitoring Unit, specifically designed for the High-Density Cooling Enclosure.

Adaptability
Top and bottom chilled water connections	Allows chilled water to be connected from the top, if routing from overhead, or the bottom, if on a raised floor.
Top cable access	Allows power and data cable to be routed into the enclosure from overhead.
Base cable access	Allows power and data cable to be routed into the enclosure from under a raised floor.
Adjustable rear vertical mounting rails	Accommodate various mounting depths from IT equipment manufacturers.

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Bomara Associates Phone: 800.5BOMARA (800.526.6272) Phone: 978.452.2299 Fax: 978.452.1169 3 Courthouse Lane, Chelmsford, MA 01824 USA
email: bobr@bomara.com web: www.bomara.com